We will update the images of the assembled PCBs in Order history for your confirmation. $7.5 per order.

Please be aware that any delays in confirming may result in delivery delays.

 JLC uses no-cleaning solder paste. SMD solder joints are not cleaned by default. After wave soldering, some flux may be left on the board. It is transparent and slightly viscous but does not affect functionality. If there are some through-hole parts on your boards and customer has strict request about the appearance, board cleaning is suggested. The extra cost is about $0.15/pc and one more day would be added to the lead time.

JLCPCB can apply acrylic-based conformal coating to protect PCBs and components against humidity, dust, chemicals, and temperature extremities. Before coating, the boards will be cleaned first, so the cleaning cost is included.

Single-sided Cost: $6.29 Engineering fee, $0.0047/cm² coating area.

E.g. For 100 cm²: $6.29 + 100 * $0.0047= $6.76

Double-sided Cost: $9.43 Engineering fee, $0.0047/cm² coating area.

E.g. For 100 cm²: $9.43 + 100 * 0.0047*2 = $10.37

For customized thickness, the coating fee would increase based on the thickness. For example, $0.0063/cm² for 201-300um, $0.008/cm² for 301 -400um.

Notes:

1. The build time adds 1 more day.

2. Conformal coating won't be applied on non-assembled components areas.

3. Please leave a remark if any areas don't need conformal coating and attach a picture highlighting these areas.

When moisture-sensitive components have been exposed to ambient air for longer than 24 hours, the components need to be dried(baked) prior to the assembly process.

Baking moisture-sensitive components can reduce the risk of package damage caused by absorbed water during reflow soldering.

Please leave a remark to specify which components(JLCPCB Part #) require baking.

Normally JLCPCB uses red antistatic bubble films for packaging.

For Cardboard packaging， the assembly boards are separated by some cardboard. It can reduce the pressure and extrusion between the products. But the volume and weight will increase, so additional shipping costs may occur.

For ESD+Cardboard packaging, each assembly board is packaged in an ESD bag, wrapped in red bubble wrap outside to prevent shaking in the courier, and then put into the cardboard. But the volume and weight will increase, so additional shipping costs may occur.

A PCB panel can be separated into single boards before delivery. $1.4 service fee and $0.3 per panel will be charged if you need us to help you separate your PCBs.

Notes:

1. The build time adds 1 more day.

2. Separated boards may not be suitable for secondary processing

3-When it is a panel design and customer selects depanelling boards before delivery, the board quantity shown on the invoice and used for customs declare is the one of the single boards. 

For example, 5 panel boards and each panel has 6 single boards. We will show 30 pieces on the inovice and customs declare as 30 pieces. 

The highest temperature requirement for reflow soldering equipment varies depending on the solder paste composition and component materials.

High temperature: The maximum temperature for reflow soldering equipment is 260℃, and there is no additional charge. Solder joint quality: The solder alloy has strong hardness.

Medium temperature: The maximum temperature for reflow soldering equipment is 235℃. Charge: $30 (custom solder paste required). Solder joint quality: The solder alloy has slightly lower hardness compared to high temperature.

Please leave a remark to Indicate which unpopulated pads require additional stencil openings or which areas should have a step stencil. Attach a picture to clearly show these areas.

Add paste for unpopulated designators cost:

$0.008/pin service cost, $3.2 enginer fee for single side and $6.4 for double sides

Step stencil opening cost:

$0.008/pin service cost, $3.2 enginer fee for single side and $6.4 for double sides, please contact customer service to get quotation if needs.

Notes:

1. There is additional labor cost $32 for single side, $64 for double sides.

2. The lead time will be 2-3 days extended.

3. About step stencil: in order to improve soldering quality and minimize soldering errors, currently for Standard assembling orders, our engineers will verify the need for a step stencil after checking the footprints of the parts selected. The step stencil enables better control of the amount of solder paste to ensure better solder quality.

For example, for components with a pins spacing of 0.4mm, the thickness of the stencil cannot exceed 0.08mm.

For components with a pins spacing of 2mm, the thickness of the stencil cannot be less than 0.12mm.

Therefore, when a board contains different components with large differences in pins spacing, step stencils are highly recommended.

If the step stencil is recommended for a spefic order, we will notify you by email and inform you of the corresponding reimbursement amount. Please understand that our recommendation is made after careful consideration of soldering quality. If the customer insists on not needing a step stencil, we will assume that the customer accepts the soldering risks that may occur when using a regular stencil.

How it works.

The flying probe contacts the pins of components on the circuit board and uses the principle of equipotential isolation to check the connections between components and whether there is a short circuit between networks. 

It can detect issues such as missing solder, open circuits, and short circuits. Currently, it mainly tests resistors and capacitors.

The cost.

For designs created with EasyEDA, the engineering fee is only $3.15. For designs from other software, the fee is $14.15.The final price will be reviewed based on the assembled quantity and the number of solder joints.

The supported files format.

ODB++, PcbDoc, EPRO, JSON. It depends on which designing software that customers use. Learn more

Nitrogen Reflow Soldering: Based on hot air reflow, nitrogen is added during heating to reduce oxygen levels in the oven, preventing component pin oxidation during soldering, improving solder wetting, reducing bubble formation in solder joints, and enhancing reliability.  Learn more>

If you require additional services such as ESD bag packaging, display screen soldering, and secondary processing, please indicate your requirements in the remark section. Learn more>