Multilayer high precision PCB's with impedance control

JLCPCB can produce High-precision multilayer board with capabilities listed in below table.

Min. Trace width/Spacing Min. Via Min. BGA
3.5mil 0.2mm 0.25mm

It is very convenient for customers to conduct an impedance matching design, according to JLCPCB’s laminated structure and related parameters. The PCB will be strictly produced in accordance with the following stackup.

Controlled Impedance PCB Parameters and Stackup

1.Prepreg dielectric constant:

Prepreg type Dielectric constant
7628 4.6
3313 4.05
2116 4.25

2.Solder mask Parameters

Solder mask thickness over the laminate Solder mask thickness over traces Solder mask dielectric constant
0.8mil 0.5mil 3.8

3. Core dielectric constant

Core dielectric constant
4.6

For your convenience, we have designed an Impedance Calculator to help you calculate the impedance and the trace width you require.

4-Layer Impedance Control Stackup

Thickness

a) JLC7628 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 7628*1 0.2104 mm
Inner Layer2 Copper 0.0152 mm 0.25 mm (with copper core)
Core Core 0.2 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2104 mm
Bottom Layer4 Copper 0.035 mm
0.2mm (7.87 mil) is nominal thickness of 7628 prepreg. Use 7.1 mil as the thickness when the controlled impedance tracks are on top/bottom, use 8.1 mil when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.45 mm (with copper core)
Core Core 0.45 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer4 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 7628 prepreg. Use 3.5 mil as the thickness when the controlled impedance tracks are on top/bottom, use 4.5 mil when tracks are inside.

a) JLC7628 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 7628*1 0.2104 mm
Inner Layer2 Copper 0.0152 mm 0.45 mm (with copper core)
Core Core 0.4 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2104 mm
Bottom Layer4 Copper 0.035 mm
0.2mm (7.87 mil) is nominal thickness of 7628 prepreg. Use 7.1 mil as the thickness when the controlled impedance tracks are on top/bottom, use 8.1 mil when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.7 mm (with copper core)
Core Core 0.7 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer4 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 7628 prepreg. Use 3.5 mil as the thickness when the controlled impedance tracks are on top/bottom, use 4.5 mil when tracks are inside.

a) JLC7628 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 7628*1 0.2 mm
Inner Layer2 Copper 0.0152 mm 0.7 mm (with copper core)
Core Core 0.7 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2 mm
Bottom Layer4 Copper 0.035 mm
0.2mm (7.87 mil) is nominal thickness of 7628 prepreg. Use 7.1 mil as the thickness when the controlled impedance tracks are on top/bottom, use 8.1 mil when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.9 mm (with copper core)
Core Core 0.865 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer4 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 7628 prepreg. Use 3.5 mil as the thickness when the controlled impedance tracks are on top/bottom, use 4.5 mil when tracks are inside.

a) JLC7628 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 7628*1 0.2104 mm
Inner Layer2 Copper 0.0152 mm 1.1mm (with copper core)
Core Core 1.065 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2104 mm
Bottom Layer4 Copper 0.035 mm
0.2mm (7.87 mil) is nominal thickness of 7628 prepreg. Use 7.1 mil as the thickness when the controlled impedance tracks are on top/bottom, use 8.1 mil when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 1.3 mm (with copper core)
Core Core 1.265 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer4 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 3313 prepreg. Use 3.5 mil as the thickness when the controlled impedance tracks are on top/bottom, use 4.5 mil when tracks are inside.

a) JLC7628 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 7628*1 0.2104 mm
Inner Layer2 Copper 0.0152 mm 1.5 mm (with copper core)
Core Core 1.465 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2104 mm
Bottom Layer4 Copper 0.035 mm
0.2mm (7.87 mil) is nominal thickness of 7628 prepreg. Use 7.1 mil as the thickness when the controlled impedance tracks are on top/bottom, use 8.1 mil when tracks are inside.

Note: 2.0 thickness 4-Layer board only provides JLC7628 Stackup.

6-Layer Impedance Control Stackup

Thickness

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.35 mm (with copper core)
Core Core 0.35 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 2116*1 0.1088 mm
Inner Layer4 Copper 0.0152 mm 0.35 mm (with copper core)
Core Core 0.35 mm
Inner Layer5 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer6 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 3313 prepreg. Use 3.5 mil as the thickness of 3313 prepreg when the controlled impedance tracks are on top/bottom, use 5.5 mil(2116 prepreg) or 8.5mil(7628 prepreg) when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.55 mm (with copper core)
Core Core 0.55 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 2116*1 0.1088 mm
Inner Layer4 Copper 0.0152 mm 0.55 mm (with copper core)
Core Core 0.55 mm
Inner Layer5 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer6 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 3313 prepreg. Use 3.5 mil as the thickness of 3313 prepreg when the controlled impedance tracks are on top/bottom, use 5.5 mil(2116 prepreg) or 8.5mil(7628 prepreg) when tracks are inside.

b) JLC3313 Stackup:

Layer Material Type Thickness
Top Layer1 Copper 0.035 mm
Prepreg 3313*1 0.0994 mm
Inner Layer2 Copper 0.0152 mm 0.7 mm (with copper core)
Core Core 0.7 mm
Inner Layer3 Copper 0.0152 mm
Prepreg 7628*1 0.2028 mm
Inner Layer4 Copper 0.0152 mm 0.7 mm (with copper core)
Core Core 0.7 mm
Inner Layer5 Copper 0.0152 mm
Prepreg 3313*1 0.0994 mm
Bottom Layer6 Copper 0.035 mm
0.1mm (3.94 mil) is nominal thickness of 3313 prepreg. Use 3.5 mil as the thickness of 3313 prepreg when the controlled impedance tracks are on top/bottom, use 5.5 mil(2116 prepreg) or 8.5mil(7628 prepreg) when tracks are inside.

Note: The 6-Layer board temporarily only provides JLC3313 Stackup.